semiconductor technologies with the most market potential in 2016
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2017-09-18
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Although smartphone growth peaked, there are a range of emerging applications such as UAVs, smart cars, virtual reality...... Emerge in an endless stream。 Semiconductor technology plays an important role in it, and the growth potential of the future market is enormous. What semiconductor technologies have market potential in 2016? The next letter is the ten largest semiconductor technology electronic Italy in 2016 we detailed the most potential market.
1 、 new sensor
Take a look at what Google, Facebook and Amazon are doing Busy with acquisitions. Google began buying an average company every week in 2010, involving artificial intelligence, VR, 3D, smart home, and cloud technology. These new technologies, new applications have a very critical link, that is, the need for sensors.
In the future, sensors will be the focus of innovation, such as motion sensors, sensing acceleration, gravity, and so on. Chemical sensors can measure PM2.5 and pesticide residues. The altimeter can be used for indoor positioning. In addition, human-computer interaction technology, speech semantics, gesture recognition, motion tracking, eye tracking and so on, sensor innovation is almost endless. With the popularity of the Internet of things and intelligent hardware, the potential for development will be enormous.
2 、 indoor positioning chip
GPS has been widely applied in the field of outdoor positioning, but it has an obvious defect is difficult for indoor positioning, and the general civilian precision is not high enough (about 10m), compared with the indoor navigation requirements (about 1m) there is a distance. As a result, people are about 80% active time location services, that is, an empty white spot. At the same time, there are huge business opportunities. At present, Google, Microsoft, apple, Broadcom and other technology giants have begun to study indoor positioning technology. You can imagine, with the future of indoor positioning chip technology commercialization, will bring a wave of innovation climax, and its influence and application prospect will never be inferior to GPS.
At present, there are many technical schemes for indoor positioning, and a new chip (BCM4752) for indoor positioning () has been developed by the Broadcom Corp. This chip can provide indoor positioning system support through WiFi, Bluetooth or NFC technology. The chip can also be combined with other sensors, such as the gyroscope in the phone, acceleration sensors, etc., to calculate the position changes in real-time. The Broadcom Corp plans to build the chip into a smartphone.
3, 3DXpoint
Storage is one of the most important parts of electronic products. It is as indispensable to electronic products as food. Every new storage technology will bring market attention. Moreover, 3DXpoint is by Intel and micron two industry's most influential companies focus on the release of technology.
The second half of 2015, Intel released a new lightning micron non-volatile memory technology 3D-Xpoint". It is understood that, Intel 3D-Xpoint SSD efficiency and durability is amazing - IOPS performance is more than 7 times faster than the traditional mainstream SSD, delay performance of more than 8 times, durability is enough to challenge the SLC-SSD standard. Intel has been using 3D-Xpoint memory equipped with SSD products as a way to enhance product performance, pull the gap between the killer product. New generation platform is expected to match Kaby Lake CPU shipped in the third quarter of 2016, it is possible to set off a wave in the high-end SSD market, bringing the memory leader, Samsung and other competitors a major threat.
It is reported that Samsung in order to fight against Intel's offensive, is now in full swing to develop new memory products, intends to integrate its own DRAM and NAND Flash technical advantages, to launch in mid 2016. Samsung's positive response should show a major change in the SSD market in the future.
4, NFC small payment
In December 2015, Apple Corp and China UnionPay formally announced that they would launch Apple&nbsp and Pay mobile payment services in China and expect users to use the service in mainland China as early as 2016. On the same day that Apple announced its cooperation with China UnionPay, China UnionPay also reached an agreement with Samsung Electronics to bring Samsung&nbsp and Pay into the Chinese market.
In recent years, the mobile payment market rapidly broke out, in 2014 the global mobile payment transactions reached 325 billion U. s.dollars, the next few years, the global mobile payment market will maintain a compound growth rate of about 40%. Compared with the remote payment, NFC (near field payment) technology of near field payment as representative, has higher security in transaction mode, hardware security, application of scene constraints are relatively small, with higher frequency, time will be optimistic about the industry, but the application in the market is China has been slow. With the Apple Corp, Samsung Corp and other international manufacturers to enter the market at the same time under Chinese, jointly promote in financial institutions, telecom operators, mobile phone manufacturers, there will be more and more equipped with NFC function, mobile phone terminal is developed. The future of NFC applications is expected to begin to spread.
5, MCU+ wireless technology
Whether it is the German industrial 4, or "Chinese 2025" are the core manufacturing, intelligent manufacturing, manufacturing digital level will increase, and the use of interconnection system to control the complex industrial production process, which makes the data in the network between the low consumption, safe and effective transmission becomes very important. Thus, the SoC chip of low power microcontroller + industrial Ethernet will become a development trend.
In all 4 products in a industrial technology, low power wireless link and micro controller will become the core of the whole system, MCU+ wireless technology is a new generation of solutions can be simplified to smart sensor and network function design, and reduce the cost BOM, create